Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
April 3, 2025 | PRNewswireEstimated reading time: 1 minute
Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud. This solution presents new opportunities to perform robust ESD analysis for P2P and CD — both earlier in the design process and at end stage ESD validation — for large, complex designs including System-on-Chip and multi-die integrated circuits. This ensures chips are protected from electrical overstress, delivering safe and reliable semiconductor products for applications including AI, high-performance computing (HPC), 5G mobile communications, automotive, memory, and graphic processors (GPUs).
To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete certification for SeaScape that includes RedHawk-SC, PathFinder-SC, and RedHawk-SC Electrothermal 3D-IC multiphysics analysis platform. Ansys Totem solution for transistor-level and mixed-signal design is also certified, delivering customers the same verification reliability and accuracy when running projects in a distributed cloud environment.
"As the scale and size of chips continues to increase, we need to consider new approaches and new technologies that ensure our customers have access to optimal design solutions that maximize the performance and power efficiency of our cutting-edge process technologies," said Lipen Yuan, senior director of advanced technology business development at TSMC. "Our collaboration with Open Innovation Platform® (OIP) partners like Ansys delivers a proven, reliable verification solution for customers advancing the forefront of semiconductor design."
"The Ansys multiphysics platform continues to prove itself a strong technical solution for a range of physics, from power integrity to high-speed electromagnetics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Our collaboration with TSMC extends multiphysics analysis for joint customers that are designing some of the most complex chips in the world and looking to take advantage of the cloud to accelerate their productivity."
Suggested Items
Micron Announces Business Unit Reorganization to Capitalize on AI Growth Across All Market Segments
04/23/2025 | MicronMicron Technology, Inc., a leader in innovative memory and storage solutions, announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.
Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
04/23/2025 | PRNewswireCeva, Inc., the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced that Nextchip has licensed the NeuPro-M Edge AI Neural Processing Unit (NPU) IP for its next-generation advanced driver assistance systems (ADAS) solutions.
Cybord Unveils ShieldScan, a Visual-AI PCBA Inspection Solution Ensuring Cyber-Physical Security and Supply Chain Integrity
04/23/2025 | PRNewswireCybord, the leading provider of advanced AI-powered electronic component analytics, announces the launch of ShieldScan, an advanced visual-AI printed circuit board assembly (PCBA) inspection solution that delivers unprecedented visibility and security in electronics manufacturing. ShieldScan automates full PCBA mapping, detects anomalies in real time, and ensures 100% board integrity, protecting manufacturers from supply chain tampering and security threats.
Critical Manufacturing, Twinzo Partner to Deliver Real-Time Digital Twin Visualization for Smart Factories
04/23/2025 | Critical ManufacturingCritical Manufacturing, a leading provider of Industry 4.0 focused manufacturing execution systems (MES), has partnered with Twinzo, an innovator in real-time 3D digital twin technology.
Cadence Enables Next-Gen AI and HPC Systems with Industry’s Fastest HBM4 12.8Gbps IP Memory System Solution
04/21/2025 | Cadence Design SystemsCadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC hardware systems.