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Advanced Electronics Packaging Digest

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Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

PewCB One Desktop PCB Prototyping System

08/24/2026 | PewCB
PewCB has unveiled the PewCB One, a desktop PCB prototyping system designed to significantly accelerate hardware development. Production of the device is scheduled to begin on September 1 in Guangzhou.

P Kay Metal's MS2 Dross Eliminator Delivers Measurable Results for Electronics Manufacturers Across Latin America

08/20/2026 | P. Kay Metal, Inc.
P Kay Metal is seeing growing adoption of its MS2 Dross Eliminator throughout the region, with customers consistently reporting solder recovery rates of 80–85%.

Incap Launches Up to €15M Share Buyback Programme

08/11/2026 | Incap
The Board of Directors of Incap Corporation has decided to initiate a share buyback programme based on the authorisation given by the Annual General Meeting held on 20 May 2026.

Pasqal Brings Qubit Control On-Chip, Advancing Fault-Tolerant Quantum Computing

08/10/2026 | Globe Newswire
Pasqal, a global leader in neutral-atom quantum computing, announced what it, to its knowledge, believes to be a world-first: the trapping of individual atoms using laser light generated by a photonic integrated circuit (PIC).
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