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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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AI, HDI, and Interconnect Optimization with MKS' ESI

04/23/2026 | Real Time with... APEX EXPO
This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.

Horizon Sales Adds LPKF Laser and Electronics to Its Lineup

04/21/2026 | Horizon Sales
Horizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology

Single Pair Ethernet (SPE): A Valuable Option for Modern Designs

04/20/2026 | Marcy LaRont, I-Connect007
When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.

Below the Surface: Looking Ahead to Where Integration Actually Happens

04/20/2026 | Chandra Gupta -- Column: Below the Surface
Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.

Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense

04/14/2026 | Jesse Vaughan -- Column: Beyond the Board
As mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.
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