Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030

05/09/2025 | IDTechEx
By 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.

NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving

05/09/2025 | NXP Semiconductor
NXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.

OSI Systems Receives $36 Million Contract for Aviation Security Systems

05/08/2025 | BUSINESS WIRE
OSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.

Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems

05/08/2025 | Cadence Design Systems
At its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.

Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference

05/06/2025 | Indium Corporation
Indium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in