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Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications

05/16/2025 | Globe Newswire
According to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”

Driving to the Future: A Pivotal Role in Standards for IPC China Automotive Electronics Committee

05/20/2025 | Sydney Xiao, IPC
In 2024, China’s automotive industry reached new heights. According to the China Association of Automobile Manufacturers (CAAM), the annual production of passenger vehicles surpassed 31 million units, marking a 4% year-over-year growth. Meanwhile, the production of new energy vehicles exceeded 12 million units, a remarkable 36.4% increase. Behind these impressive numbers lies a collective effort fueled by technological innovation, industrial upgrades, and the dedication of countless industry professionals.

Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape

05/13/2025 | TrendForce
TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.

Cadence, AVCC to Advance Physical AI Innovations for Autonomous Vehicles

05/12/2025 | Cadence Design Systems
Cadence has joined the Autonomous Vehicle Computing Consortium (AVCC), marking a significant step forward in Cadence's commitment to advancing autonomous vehicle technology for the physical AI era by working with industry leaders to define high-performance computing (HPC) and safety solutions for next-generation autonomous vehicle systems.

DENSO, ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor

05/12/2025 | DENSO
DENSO CORPORATION and ROHM Co., Ltd. are pleased to announce that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.
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