BAE Systems Selected to Enhance Ground System for Space Force Missile Warning Satellites
April 29, 2025 | BAE SystemsEstimated reading time: 1 minute
BAE Systems has been selected by U.S. Space Force Space Systems Command to provide a new satellite command and control (C2) system for its Future Operationally Resilient Ground Evolution (FORGE) program.
FORGE C2 will provide the Space Force with a command-and-control system for several of its Next-Generation Overhead Persistent Infrared (Next-Gen OPIR) missile warning satellites. In addition, the on-orbit Space Based Infrared System (SBIRS) constellation will be transitioned onto the FORGE C2 system.
Under FORGE C2, the Space Force will utilize BAE Systems’ software solution to consolidate telemetry, tracking and command, flight dynamics, mission management, and ground resource management applications onto a single framework. This will allow satellite operators to command and control the Space Force’s missile warning satellites with the same core applications, which will simplify operations, reduce operations and maintenance costs, minimize training, and provide extensibility to future missile warning systems.
“FORGE C2 represents an innovative new approach to advancing command and control capabilities for the Space Force,” said Don Speranzini, vice president and general manager of Ground Systems & Services for BAE Systems Space & Mission Systems. “Our team has worked as a mission partner with the Space Force to develop a system that effectively monitors threats and helps strengthen the defense of the U.S. and our allied nations. We’re proud to contribute to this critical mission.”
The FORGE C2 program builds on BAE Systems’ history of developing industry-leading ground systems for the defense and intelligence communities.
BAE Systems also helped develop infrared sensor payloads for the Next-Gen OPIR constellation and leveraged the company’s deep knowledge of the mission to assist in advancing FORGE C2.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
IPS, SEL Raise the Bar for ENIG Automation in North America
09/11/2025 | Mike Brask, IPSIPS has installed a state-of-the-art automated ENIG plating line at Schweitzer Engineering Laboratories’ PCB facility in Moscow, Idaho. The 81-foot, fully enclosed line sets a new standard for automation, safety, and efficiency in North American PCB manufacturing and represents one of the largest fully enclosed final finish lines in operation.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
U.S. Army Begins Fielding BAE Systems’ Mission-critical Software-defined Radios Across Rotary-wing Aviation Fleet
09/08/2025 | BAE SystemsBAE Systems’ AN/ARC-231A Multi-mode Aviation Radio Set (MARS) has completed initial installation and is operationally ready for use today on select U.S. Army rotary-wing aircraft.