Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
May 1, 2025 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system. This advanced equipment, developed by CBT and supplied by Technica USA, is renowned for its high-speed, high-resolution imaging capabilities, particularly for photoimageable solder masks.
The TiTAN PSR-H model offers several key features:
- High-Speed Imaging: Recognized as the fastest in its class for all photoimageable solder masks, including standard, black, and white variants.
- Versatility: Capable of handling both dry film and solder mask printing with exceptional front-to-back registration accuracy.
- Precision: Delivers print resolutions down to 10 microns, powered by CBT’s patented technology.
This installation aligns with Summit Interconnect’s commitment to integrating cutting-edge technology across its facilities to meet the evolving demands of the PCB industry. The Hollister site, known for specializing in 24-hour quick-turn PCB prototyping, will benefit from the TiTAN system’s capabilities, ensuring faster turnaround times and enhanced quality for complex PCB designs.
By investing in such advanced imaging technology, Summit Interconnect reinforces its position as a leading provider of high-reliability, advanced technology printed circuit boards in North America. This move not only boosts the Hollister facility’s operational efficiency but also enhances its ability to serve industries requiring rapid prototyping and precision manufacturing.
Share on:
Suggested Items
COMPUTEX 2025 Concludes Successfully AI Deployment Accelerates as Taiwan Solidifies Its Strategic Global Position
05/23/2025 | PRNewswireCOMPUTEX 2025 concluded today after four days of dynamic exhibitions and events. The show welcomed an impressive turnout, with 86,521 buyers from 152 countries, including Japan, the United States, South Korea, Vietnam, and India.
Lockheed Martin, Fujitsu Strengthen Japan Industry Collaboration with SPY-7 Supplier Selection and Strategic Agreements
05/23/2025 | JCN NewswireLockheed Martin, a global leader in the development and delivery of cutting-edge radar solutions, and Fujitsu Limited, a Japanese multinational leader in information and communications technology and digital services, announced the conclusion of a Memorandum of Understanding (MOU) establishing Fujitsu as a source for the SPY-7 Subarray Suite Power Supply Line Replaceable Unit (PS LRU). Purchase orders in support of the Aegis System EquippedVessel program are anticipated later in 2025.
HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%
05/22/2025 | TrendForceTrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.
TRUMPF Electronics Announces the Opening of a Technical Center in Southeast Asia
05/22/2025 | TRUMPF ElectronicsTRUMPF Electronics, one of world’s leading plasma power suppliers for the semiconductor sector, marked its entry into the Southeast Asian market with a debut at SEMICON SEA 2025, alongside its new regional technical center in Malaysia.
Neways Electronics Celebrates Grand Opening of New Manufacturing Facility in Malaysia
05/22/2025 | Neways Electronics International N.V.Neways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, is proud to announce the grand-opening of a new state-of-the-art manufacturing facility in Selangor, Malaysia.