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Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand

05/13/2025 | Prashant Patel -- Column: Facing the Future
Innovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.

DENSO, ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor

05/12/2025 | DENSO
DENSO CORPORATION and ROHM Co., Ltd. are pleased to announce that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.

Baker Hughes' Waygate Unveils Nanotom HR for Advanced Inspection

05/06/2025 | Baker Hughes
Waygate Technologies, a Baker Hughes business and global leader in nondestructive testing (NDT) solutions for industrial inspection, unveiled its new extremely high-resolution computed tomography (CT) system, Phoenix Nanotom® HR (High Resolution) at the Control 2025 show in Stuttgart, Germany.

Visteon, Qualcomm Redefine Next-Generation AI-based Intelligent Cockpit Experience

04/28/2025 | PRNewswire
At Auto Shanghai 2025, Visteon Corporation, a global leader in automotive cockpit electronics, and leading automotive technology company, Qualcomm Technologies, Inc., announced a technology collaboration to bring groundbreaking capabilities to the automotive industry with Visteon's new high-performance cockpit system, powered by Visteon's automotive artificial intelligence (AI) framework, cognitoAI, and Qualcomm Technologies Snapdragon® Cockpit Elite Platform.

LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability

04/24/2025 | LITEON Technology
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
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