Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
May 12, 2025 | BEST Inc.Estimated reading time: 1 minute
BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Our component salvaging services include BGA’s, QFN’s and LGA’s, BGA re-balling, and reconditioning. All are performed with strict MSD and ESD safeguards. We also offer remarking, bake-out, and packaging in trays, tubes, or tape and reel in accordance with EIA-481 standards. The process involves mechanical disassembly of electronic devices, selective removal of soldered components, reconditioning of leads and pads, laser marking for traceability, and packaging optimized for automated circuit board assembly.
BEST specializes in properly processing and preparing printed circuit boards, ensuring components are safely removed and correctly conditioned for re-insertion into the manufacturing flow. Harvesting components from PCBs helps alleviate shortages of high-value or hard-to-source electronic devices. Our expertise includes reconditioning ball grid arrays, ultra-fine pitch QFPs, QFNs, LGAs, and other electronic packages, providing end-users with confidence in our high-quality reclaiming processes. Our extensive experience in BGA removal, replacement, and reballing makes our salvaging services particularly effective and valuable. With years of industry expertise, we deliver the highest yields while maintaining strict standards of quality and reliability.
In conjunction with our ongoing electronic component reclamation activities, BEST is actively involved with the development of the IPC-7712 Component Reclaim Standard to advance circularity within the electronics manufacturing industry and expand the ability of component reuse as opposed to recycling of electronic waste.
The importance of using high-quality workmanship standards throughout the component reclamation process is essential. This serves to ensure the integrity of the component supply chain, facilitating environmental responsible practices, and reducing reliance on energy intensive fabrication of new electronic components.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.