Siemens Democratizes AI-driven PCB Design for Small and Medium Electronics Teams
May 21, 2025 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announced today that it is making its AI-enhanced electronic systems design technology more accessible to small and mid-sized businesses (SMB) with PADS™ Pro Essentials software and Xpedition™ Standard software.
Built on Siemens’ Xpedition technology, these new offerings combine intuitive user experiences, integrated cloud collaboration and AI-driven automation to empower small teams and independent engineers with the same professional-grade capabilities trusted by the world’s most advanced electronics companies, at a fraction of the cost.
“Today’s launch marks a major milestone in our strategy to democratize access to high-performance PCB design and bring the transformative power of AI to the PCB design workflow,” said AJ Incorvaia, senior vice president, Siemens EDA. “With PADS Pro Essentials and Xpedition Standard, we’re delivering scalable solutions that help smaller teams move faster, work smarter, and design with confidence without sacrificing quality or budget.”
PADS Pro Essentials delivers a streamlined, cloud-connected design environment built on Siemens’ proven Xpedition technology at an entry-level price. Tailored for independent engineers and startups, it includes schematic capture, layout, and a seamless design experience that lowers barriers to professional-grade PCB design tools. The Essentials tier also introduces an integrated, co-branded front-end powered by CELUS, allowing engineers to design using intelligent functional blocks with AI-assisted schematic and BOM generation.
Xpedition Standard is built for growing teams that need a balance of cost-efficiency and advanced capabilities. It adds powerful features like design reuse, variant management, advanced routing automation, native 3D layout and deeper collaboration across mechanical, manufacturing and supply chain stakeholders. Teams can further extend capabilities using token-based options, which provide on-demand access to more advanced capabilities such as fully integrated pre- and post-layout signal integrity analysis powered by Siemens’ Hyperlynx™ software for PCB analysis and rigid-flex design without requiring a full tier upgrade.
“We took a close look at Xpedition Standard and were genuinely impressed," said Shrouk El-Attar, founder, Shrouk El-Attar consultancy. "Siemens has clearly reimagined the experience. It's intuitive, modern, and far more connected and integrated than we expected. From day one, it felt like a tool built for the way we actually work. I can get real design work done without fighting the software."
Part of the Siemens Xcelerator portfolio of industry software, both new offerings are part of the Xpedition family and are designed to grow with engineers, from individual users to global enterprises. The unified user experience, design libraries and cloud-based collaboration infrastructure provide a seamless upgrade path as team and project requirements evolve.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025
08/20/2025 | Tara Dunn, SMTAThe Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
08/19/2025 | Happy Holden -- Column: Happy’s Tech TalkWith the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.