ACCM Joins Polar’s Speedstack Material Partner Program
June 10, 2025 | Polar InstrumentsEstimated reading time: Less than a minute
Advance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
“Availability of Celeritas in Speedstack eases the specification of ACCM materials for the OEM design community. PCB Technologists often mandate specific materials for demanding high-speed and high-density applications,” said Michael Gay, VP of marketing at ACCM.
This partnership:
- Allows simplified production of build-up technologies with Celeritas
- Provides an on-line and on premise material library from ACCM in Speedstack
- Opens new opportunities to extend the use of UHDI
Speedstack is in widespread use with OEMs who specify PCB stackups for specific applications, and eases the communication of stackup information throughout the PCB supply chain as PCB fabricators across the world are familiar with Speedstack’s clear and concise documentation and the availability of stackup data in XML format which can be imported into multiple production systems at the time of fabrication.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/25/2025 | Marcy LaRont, I-Connect007In industry news this past week, I’m putting a focus on sustainability in electronics by highlighting my interview with Kelly Scanlon and Corey Dehmey, and Nolan Johnson’s Meet the Author podcast with Beth Turner of MacDermid Alpha Electronics Solutions. I also chose to spotlight the M&A activity and outlook in the U.S. market and regional market news in India and Mexico.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.
From Factory Floor to ‘The Component Store’
07/25/2025 | Marcy LaRont, I-Connect007Daniel Beauvois began his career in PCB manufacturing 15 years ago with zero industry experience—just a willingness to learn. Daniel immersed himself in every step of circuit board production, from hanging out on the factory floor to giving plant tours. Now, as founder of The Component Store, he’s an independent sales rep known for integrity, persistence, and deep technical knowledge. In this interview, Daniel reflects on his journey, the realities of being an outside rep, and what it takes to earn—and keep—a customer’s trust in an ever-evolving electronics industry.
LPKF Increases Revenue in the 1H of 2025 Despite global uncertainties
07/24/2025 | LPKFThe LPKF Group increased revenue by 7.2% to EUR 59.2 million in the first half of 2025 and achieved an almost balanced adjusted EBIT* (earnings before interest and taxes) of EUR -0.7 million.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/24/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.