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Advanced Electronics Packaging Digest

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Siemens to Acquire Precision Innovations to Expand AI-Powered Chip Design Optimization

07/20/2026 | Siemens
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.

Zuken Joins TSMC’s Open Innovation Platform® EDA Alliance

07/08/2026 | Zuken
Zuken Inc. announced that it has joined the EDA Alliance in TSMC’s Open Innovation Platform® (OIP).

Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working

06/11/2026 | John Watson -- Column: Elementary, Mr. Watson
Signal integrity follows physics that are consistent, predictable, and fully explainable. But those rules don’t show up in the schematic. Instead, they live in the electromagnetic fields around the traces, in the stackup, and in the relationship between conductors and their return paths. The authors weren’t claiming black magic; they were calling out how it feels until you learn what’s going on. The fact that they said it more than 30 years ago only reinforces how fundamental and enduring these concepts really are.

Beyond Design: How Signals Survive the Hostile PCB Environment

06/03/2026 | Barry Olney -- Column: Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system. Successful design isn’t about routing signals anymore; it’s about engineering transmission lines, preserving uninterrupted return‑current paths, and controlling the resonant structures that naturally form within the multilayer PCB.

Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
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