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July 22, 2025 | Federal ElectronicsEstimated reading time: 1 minute
Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Mycronic PI Primo M 3D Solder Paste Inspection (SPI) system at its Hermosillo, Mexico facility, advancing the site’s precision inspection and process control capabilities.
The PI Primo M, part of Mycronic’s advanced SPI platform, delivers high-speed, high-resolution 3D inspection for solder paste applications, enabling immediate feedback and tighter control of the printing process. With its compact design and fast throughput, the system is well suited for Hermosillo’s high-mix, fast-paced production environment.
“Our Hermosillo operation is built for performance and precision,” said Ed Evangelista, President of Federal Electronics. “Adding the PI Primo M allows us to further improve consistency and accuracy across every board, particularly for the AS9100 programs we’re supporting.”
Federal Electronics’ Hermosillo facility plays a central role in the company’s global operations, offering cost-effective, nearshore manufacturing to OEMs throughout North America. The site is fully integrated with the company’s Cranston, Rhode Island headquarters via a shared ERP and IT infrastructure, enabling real-time coordination, traceability, and seamless production management across both locations.
Staffed by over 350 skilled professionals, the Hermosillo facility is fully equipped for high-reliability, high-mix electronics assembly. It now supports a growing number of AS9100-certified programs and serves OEM customers across the Midwest, Southwest, and Western United States seeking agile, U.S.-aligned manufacturing solutions.
The addition of the PI Primo M strengthens Federal Electronics’ ongoing effort to scale its capabilities with leading-edge inspection and automation technology—helping OEMs accelerate delivery timelines, reduce errors, and achieve their production goals with greater efficiency.
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