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July 31, 2025 | FlashPCBEstimated reading time: 1 minute
FlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
The Heller 1809 MKII is a 9-zone convection reflow oven designed for high-volume environments that require stable thermal performance, low nitrogen consumption, and reduced operating costs. Known for its robust construction and efficient design, the system provides repeatable thermal profiles while optimizing power usage and footprint. Its closed-loop convection technology and advanced thermal uniformity help ensure tight process tolerances, even with complex board layouts.
The KIC ProBot, an embedded reflow monitoring and inspection system, automatically calculates the reflow profile of every assembled production board without disrupting production flow. The system combines real-time data collection with built-in SPC analytics, providing process engineers with actionable insights into soldering quality, and catching anomalies before they become defects. With features such as automatic profile comparison against pre-defined specs, pass/fail indicators, and real-time process control, ProBot ensures full traceability and zero-defect production through the reflow process.
“This new equipment is a powerful upgrade to our reflow capabilities,” said Thomas Castner, CEO at FlashPCB. “The precision of the Heller 1809 MKII, combined with the real-time thermal process inspection from KIC ProBot, enables us to maintain tight quality standards while increasing efficiency across fast-turn projects.”
The equipment is now live at FlashPCB’s facility and supports assembly work for industries including aerospace, medical, consumer electronics, and industrial automation.
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