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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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SIA Statement on Semiconductor Tariffs Announcement
August 8, 2025 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding President Trump’s semiconductor tariff announcement. The semiconductor industry is investing $630 billion in 28 states across America, strengthening our economic and national security, and delivering on the President’s goal to revitalize American semiconductor manufacturing. To sustain these investments, America must be a cost-competitive location to develop and produce chips.
“We are eager to learn more about the President’s plan for semiconductor tariffs, including the scope and structure of exemptions for companies manufacturing in the U.S. Trade is critical to American semiconductor leadership. And so we hope the tariff exemptions and future trade deals are designed to ensure the U.S. semiconductor industry retains its pole position in the race to be the most globally competitive.
“We look forward to working with the Administration to shape global trade initiatives to ensure American semiconductor leadership for many years to come.”
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Foxconn Research Institute, National Yang-Ming Chiao Tung University Jointly Create a New Era of Spatial Computing
08/08/2025 | FoxconnThis technological breakthrough was achieved by Director Guo Haozhong of the Semiconductor Division of Hon Hai Research Institute and Chair Professor at National Yang-Ming National Chiao Tung University, in collaboration with Group Leader Hong Yuheng, Researcher Xu Yezheng, and Researcher Miao Wenqian of the Semiconductor Division, and a research team led by Assistant Professor Huang Yaowei of National Yang-Ming National Chiao Tung University.
MKS Inc. Reports Q2 2025 Financial Results
08/07/2025 | MKS Inc.MKS Inc., a global provider of enabling technologies that transform our world, reported its financial results for the second quarter of 2025.
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.
onsemi Reports Second Quarter 2025 Results
08/05/2025 | onsemionsemi announced its second quarter 2025 results with revenue of $1,468.7 million.
MACOM Completes Transfer of RTP Wafer Fab
08/05/2025 | MACOMMACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced it has assumed full operational control of the wafer fabrication facility it purchased, located in Research Triangle Park, North Carolina.