Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
August 20, 2025 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
With nearly 25,000 systems installed at over 3,800 manufacturing sites, Koh Young set the standard in automated optical inspection for the electronics manufacturing industry. Building on that foundation, it expanded into semiconductor manufacturing with higher‑resolution optics, advanced measurement algorithms, and solutions engineered for metrology and inspection of wafer‑level packages (WLP), system‑in‑package (SiP), and ultra high-density interconnect applications.
As an exhibitor, Koh Young will highlight how its AI‑powered metrology and inspection solutions can help manufacturers meet the exacting demands of advanced packaging and semiconductor processes. From wafer‑level to SiP, Koh Young technology delivers accurate, repeatable data to enable smarter process control, higher yields, and supports zero‑defect production goals.
Dimensional Metrology for Advanced Packaging
Koh Young’s Meister Series is purpose‑built for advanced packaging, including SiP, WLP, and die stacking metrology. These systems provide ultra‑high‑resolution 2D/3D measurement to manage features and tolerances in next‑generation designs. Complementing the Meister Series, the ZenStar delivers wafer‑level dimensional metrology to detect and quantify critical parameters at the earliest stage, ensuring only known‑good components advance. Together, these platforms help manufacturers maintain process windows, improve yield, and reduce costly rework.
As India accelerates its Make in India semiconductor mission, Koh Young is committed to supporting local and multinational manufacturers in building a competitive, self‑reliant ecosystem for advanced electronics. By delivering robust, data‑driven metrology and inspection, Koh Young enables domestic production that meets the stringent standards of global supply chains.
“India’s semiconductor industry is entering an unprecedented growth phase,” said Peter Shin, General Manager, Koh Young South‑East Asia. “Our advanced dimensional metrology and inspection solutions empower manufacturers to deliver world‑class quality, improve productivity, and strengthen India’s position in the global semiconductor market.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution
10/07/2025 | Agileo AutomationAgileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance.
SEMICON Europa 2025 to Highlight Innovations in Advanced Packaging, Fab Management, and MEMS and Imaging Sensors
10/06/2025 | SEMISemiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
Global Semiconductor Sales Increase 21.7% Year-to-Year in August
10/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $64.9 billion during the month of August 2025, an increase of 21.7% compared to the August 2024 total of $53.3 billion and 4.4% more than the July 2025 total of $62.1 billion.
Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split
10/03/2025 | I-Connect007 Editorial TeamTaiwan stated on October 1 that it will not agree to a U.S. proposal to shift half of its semiconductor production to the United States, despite mounting pressure from Washington over tariffs and chip supply security, according to Reuters.
SEMICON Europa 2025 to Highlight Innovations in Advanced Packaging, Fab Management, and MEMS and Imaging Sensors to Bolster Europe’s Semiconductor Resilience
10/03/2025 | SEMISemiconductor industry experts will convene at SEMICON Europa 2025, November 18-21 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.