Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
August 26, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and 2, will focus on the role of metal-based TIMs in addressing key challenges across TIM1, TIM1.5, and TIM2 interfaces, including the need to reduce thermal resistance, minimize voiding, and enhance mechanical reliability under thermal cycling. Metal TIMs provide high thermal conductivity, excellent structural stability, and reliable performance across a range of interface conditions, including warped or non-planar surfaces.
“As AI and HPC systems continue to advance, thermal management has become essential to support increasing power densities and packaging complexity,” said Foo. “By highlighting application insights and recent advancements, this presentation will provide a practical perspective on how metal TIMs are enabling next-generation AI and HPC packaging through more reliable, efficient thermal solutions.”
As assistant product manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.
Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.
The presentation will take place on Thursday, September 18, at 10:50 a.m.
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Indium to Present High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions enabling today’s demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge on two industry-critical topics at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026
04/23/2026 | RemtecRemtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.