Coming Soon: The Advanced Electronics Packaging Digest
August 27, 2025 | Marcy LaRont, I-Connect007Estimated reading time: 1 minute
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP).
In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective. In this interview, he explains the concepts and tactical realities behind the term “advanced electronics packaging,” emphasizing why a systems approach is critical to developing reliable, scalable, and sustainable solutions. With billions of dollars riding on this sector of electronics manufacturing, and mounting pressure to meet unprecedented demand for modern electronic products, data processing, and storage, Kelly makes a compelling case for getting it right early in the process.
Also included in this first issue:
- A recent Global Electronics Association white paper that more fully explains the concept of advanced electronics packaging
- The first installment in a new series from automotive and EV expert Stanton (Stan) Rak, who explores the rapidly evolving technology requirements in automotive electronics, both current and future
- A curated selection of recent news highlights
- A global events calendar dedicated to advanced packaging, ensuring you have the latest resources at your fingertips
Looking ahead, our October issue will launch a new series of company and personnel spotlights, showcasing the innovators driving progress in this complex and highly technical field. We’ll also feature insights from a supplier focused on PCB and interconnect solutions designed to address one of the industry’s greatest challenges: thermal management in advanced packaging designs.
We invite you to subscribe today to stay informed and connected. If you’re interested in contributing to the digest or would like to suggest topics for future coverage, please reach out to marcy@iconnect007.com.
To subscribe to the digest, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
North American PCB Industry Shipments Up 20.7 Percent in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00. Total North American PCB shipments in July 2025 were up 20.7% compared to the same month last year.
Tigo Energy Initiates ‘Made in the USA’ Manufacturing Partnership With EG4 Electronics Share
08/27/2025 | BUSINESS WIRETigo Energy, Inc announced a manufacturing and marketing partnership with EG4 Electronics to produce Tigo optimized inverters and Module Level Power Electronics (MLPE) together with EG4 solar inverters in the United States of America.
North American EMS Industry Shipments Down 4.1% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
SMTA Elects New Board Members
08/27/2025 | SMTAThe SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning October 19, 2025. Elizabeth Benedetto, HP Inc.; Pratish Patel, Electronic Interconnect; and Sutharshan Suppiramaniam, SMT Elite Corporation, have been newly elected to the Board of Directors for the term 2025-2028.
Indium Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics
08/26/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.