ICZOOM Launches PCB & SMT Services to Strengthen One-Stop Electronics Industry Solution at IIC Shenzhen 2025
August 28, 2025 | PRNewswireEstimated reading time: 1 minute
ICZOOM Group Inc., a B2B electronic component products e-commerce platform, successfully exhibited at the 2025 International Integrated Circuit & Component Exhibition and Conference (IIC Shenzhen 2025) held from August 26 to 28 at the Shenzhen Convention & Exhibition Center in Futian District. At the event, ICZOOM officially announced the launch of its integrated printed circuit board (PCB) manufacturing and surface mount technology (SMT) assembly services.
Organized by AspenCore, a globally renowned electronics industry media organization, IIC Shenzhen 2025 brought together leading enterprises and professionals from the integrated circuit industry worldwide, serving as one of the most influential platforms for electronic component industry. ICZOOM and its subsidiary, Shenzhen Hjet Supply Chain Co., Ltd., have attracted attention at the exhibition by showcasing their e-commerce platform and supply chain service capabilities.
ICZOOM officially announced its launch of PCB and SMT services at the event. This initiative marks ICZOOM's expansion beyond component distribution into manufacturing services, which establishes a more comprehensive profit model and service loop, and enhance its vision of a "One-Stop Electronics Manufacturing Solution."
ICZOOM will leverage its industry network and experience to partner with high-quality manufacturers in the industry to integrate PCB and SMT services into its existing one-stop order fulfilment services, which will provide customers with full-process services ranging from electronic component procurement, customs declaration, smart warehousing and PCB manufacturing to SMT assembly.
With its continuing efforts to serve small and medium-sized enterprise ("SME") customers, ICZOOM believes that these newly launched PCB and SMT solutions could satisfy its customers' increasing needs, strengthen its comprehensive service capabilities.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Kimball Electronics Reports Q3 Results With Double-Digit Sequential Medical Sales Growth
05/07/2026 | Kimball ElectronicsKimball Electronics, Inc. announced financial results for the third quarter ended March 31, 2026.
IMI Reports Stronger Performance and Return to Profitability in 2025
05/06/2026 | IMIIntegrated Microelectronics, Inc. (IMI) reported a significantly improved performance in 2025, reflecting the positive results of its multi year transformation focused on operational efficiency, portfolio optimization, and strengthening core capabilities.
Incap Group Reports Q1 2026 Revenue Growth and Completion of Lacon Acquisition
05/06/2026 | IncapIncap estimates that the company’s revenue and comparable EBITA in 2026 will be clearly higher than in 2025. The estimates include the impact of Lacon’s acquisition and are given provided that unexpected events impacting Incap’s business environment do not occur.
Flex Completes Acquisition of Electrical Power Products (EP²)
05/06/2026 | PRNewswireFlex announced the completion of its acquisition of Electrical Power Products, Inc. (EP²), a leading provider of engineered‑to‑order electrical power control and protection systems.
Plexus Announces Planned Chief Financial Officer Transition
05/04/2026 | PlexusPlexus Corp. announced that Patrick Jermain, Executive Vice President and Chief Financial Officer (CFO), has elected to retire after a distinguished 15-plus year career at Plexus, including 12 years as CFO.