American Made Advocacy: Congress Back from Break With Work To Do
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
September 9, 2025 | ElephantechEstimated reading time: 1 minute
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan. As of August 2025, Elephantech is the first and only company selected in the GX program for the DMP phase. As part of this selection, Elephantech will receive a subsidy of approximately 2.3 billion Yen at most to support its future growth.
The initiative centers around Elephantech’s proprietary low-carbon printed circuit boards (PCBs) manufacturing solution, SustainaCircuits, which aims to establish a mass production system utilizing inkjet printing equipment as manufacturing equipment and copper nano-ink & primer as printing materials.
As PCBs account for a significant portion of the electronics sector’s GHG emissions, making their fabrication greener is essential to achieving carbon-neutral objectives. Elephatech is actively addressing this challenge by improving production efficiency and driving decarbonization across the sector through the adoption of SustainaCircuits at PCB manufacturing facilities.
Building on its novel SustainaCircuits technology, Elephantech has been mass-producing flexible printed circuits in-house and supplying them to major electronics manufacturers. Following the successful development of a general-purpose multilayer PCB in 2024, the company is now expanding beyond in-house production to offer turnkey manufacturing solutions to PCB manufacturers, accelerating broader implementation of SustainaCircuits technology. Going forward Elephantech will continue advancing environmentally responsible growth of the electronics industry through sustainable and innovative technologies.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Elephantech, Logitech Together Drive Disruptive Electronics Innovation
05/01/2025 | ElephantechElephantech Inc. announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the printed circuit board (PCB) industry.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
04/30/2025 | ElephantechJapanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing.
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
04/24/2025 | LITEON TechnologyLITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.