ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
September 15, 2025 | ASM TechnologiesEstimated reading time: 1 minute
ASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Speaking about the MoU, Rabindra Srikantan, Managing Director of ASM Technologies Limited, said, “This MoU marks a significant step forward in ASM Technologies Limited’s growth journey. With this ₹250 crore investment, we are expanding our design-led manufacturing capabilities in the ESDM sector, strengthening our expertise in precision engineering for electronics, solar industries and semi. This expansion underscores our commitment to innovation, global competitiveness and scaling our operations to meet the evolving demands of our customers. We thank Guidance, Government of Tamilnadu for their support in enabling this growth.”
Representing ASM Technologies Limited at the signing, Preeti Rabindra, Director, added: “On behalf of ASM Technologies Limited, I am pleased to sign this MoU with the Guidance, Government of Tamil Nadu. This initiative reflects our focus on expanding ASM’s design-led manufacturing capabilities, creating advanced solutions for the ESDM sector, and building on our strong track record of innovation. This investment will further strengthen ASM’s role as a trusted partner for global clients while opening new opportunities for growth and excellence.”
ASM Technologies has its existing operations from its two new state-of-the-art manufacturing facilities at Dabaspet, Karnataka and Sriperumbudur, Tamil Nadu. The facilities are expected to give a fillip to the company’s design-led manufacturing operations and will serve as core centres of excellence for its clients across key industry verticals.
These developments mark yet another step in ASM’s pursuit of leadership in engineering innovation and its commitment to the highest degree of excellence. This also complements the Government of India’s ‘Make in India’ initiative. Through these investments, the company plans to augment its capabilities and offerings in design-led manufacturing and precision engineering while contributing to industrial progress.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).