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TSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
The company currently produces 4-nanometer (N4) chips for Apple and Nvidia at its first Arizona facility, Fab 21, which began volume production earlier this year. Its second fab, originally slated to produce 3-nanometer (N3) chips in 2028, may now see an upgrade to even more advanced technology.
"We are preparing to upgrade our technologies faster ... to more advanced process technologies in Arizona, given the strong AI-related demand from our customers," TSMC CEO C.C. Wei said during the company’s third-quarter earnings call in mid-October.
Wei didn’t say if the expedited plan means skipping N3 to go directly to 2-nanometer (N2) or A16. However, this move would mark a significant change for TSMC, which has usually kept its most advanced manufacturing in Taiwan.
The decision comes as American chip makers, including Apple, Nvidia, and AMD, push to produce more components domestically, especially as potential tariffs on imported electronics and growing geopolitical concerns have further spurred demand for U.S.-made chips.
Intel may also be pushing for TSMC to meet its deadlines. The rival chip maker’s forthcoming 2-nanometer-class “18A” process, which features backside power delivery to boost transistor density, is already being manufactured in the U.S. The technology will power Intel’s upcoming Panther Lake and Clearwater Forest processors.
TSMC’s faster timeline suggests a plan to stay ahead in the global AI chip race, as Intel’s foundry division pursues big clients and highlights its US-based production.
