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Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Dr. Wang’s presentation, Enhanced Reliability of Large BGA Assemblies for AI Server and HPC Application, will provide practical insights on how Indium Corporation’s award-winning Durafuse® LT delivers sustainability, durability, and progress within large ball grid array (BGA) packages intended for artificial intelligence (AI) servers and high-performance computing (HPC) systems. HPC systems face reliability risks due to thermal-cycling stress and are driven by coefficient of thermal expansion (CTE) mismatch and package warpage. The conventional combination of SAC305 BGA ball and SAC305 solder paste no longer meets reliability requirements, but Durafuse® LT provides a sustainable solution for next-generation AI and HPC applications.
The presentation was co-authored by Hongwen Zhang, Ph.D., and Wisdom Qu, Indium Corporation; and Xianfeng Chen.
“This presentation is for anyone who is looking for a sustainable solution for large BGA assembly in next-generation AI and HPC applications,” Dr. Wang said. “This work provides practical insights into how to improve thermal fatigue resistance, while reducing warpage, energy consumption, and carbon footprint through materials selection and lower-temperature processing.”
Huaguang Wang, Ph.D., joined Indium Corporation in 2019. He is a Research Metallurgist in the Research & Development Department. His work focuses on the development of low- and mid-temperature, lead-free solder materials with high reliability. Dr. Wang has co-authored numerous technical papers and holds several patents in the field of lead-free solder innovation. He earned his Ph.D. in Materials Science and Engineering from Michigan Technological University and holds both a master’s and a bachelor’s degree in Metallurgical Engineering from Central South University in China. He is also a Certified SMT Process Engineer.
This presentation will take place on Friday, December 5, from 11:45 a.m.–12:00 p.m. SGT.
