Semicon India Programme Builds Full Semiconductor Design-to-Packaging Ecosystem

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The semiconductor development strategy is inspired by Hon’ble Prime Minister’s vision of Atmanirbhar Bharat and Make in India, Make for the World.

Given the foundational nature of semiconductor industry for the economy, the Government launched the ‘Semicon India Programme’ to develop a complete ecosystem ranging from design, fabrication, assembly, testing and packaging.

Following investments have been received under semicon India Programme and PLI schemes for electronics sector:

• Under Semicon India Programme, ten (10) units have been approved with an investment of Rs 1.6 Lakh Cr which include Silicon fab, Silicon Carbide fab, advanced packaging, memory packaging, etc.
  These would cater to chip requirements of sectors such as consumer appliances, industrial electronics, automobiles, telecommunications, aerospace, and power electronics etc.
  Few of the approved proposals are using indigenous technology for assembly, testing and packaging of semiconductor chips.
• Government launched Production Linked Incentive scheme (PLI) for large scale electronics manufacturing of mobile phones and certain specified components. The scheme has attracted investment of Rs 14,065 Cr. up to October 2025.
• To target manufacturing of IT Hardware, Government launched PLI for IT Hardware for promoting manufacturing of laptop, tablets, server and ultra small form factor (USFF) devices.
  PLI for IT hardware have attracted investment of Rs 846 Cr till October 2025.

As a result of these policy efforts, electronics manufacturing has grown almost six (6) times in last 11 years. It has increased from Rs 1.9 lakh Cr in 2014-15 to Rs 11.32 lakh crore in 2024-25.

Electronics exports have grown eight (8) times from Rs 38 thousand Cr in 2014-15 to Rs 3.26 lakh Cr in 2024-25. Electronics is now the third largest export category.

Promoting design ecosystem

To leverage India’s strength in chip design, Government launched Design Linked Incentive (DLI) Scheme.

Support has been provided for 23 companies (24 designs) for designing chips and SoCs for the products in satellite communication, drones, surveillance camera, Internet of Things (IoT) devices, LEDs driver, AI devices, telecom equipment, smart meter, etc.

Further, as infrastructure support, free design tool (EDA) access has been provided to 94 startups enabling 47 lakh hours of design tool usage