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Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/14/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

Below the Surface: Looking Ahead to Where Integration Actually Happens

04/20/2026 | Chandra Gupta -- Column: Below the Surface
Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.

Murata Manufacturing Completes New Production Facility in Izumo

04/07/2026 | Murata
Izumo Murata Manufacturing Co., Ltd., a manufacturing subsidiary of Murata Manufacturing Co., Ltd. located in Izumo City, Shimane Prefecture, has completed the construction of a new production building that had been under construction since March 2024.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

03/17/2026 | Chandra Gupta -- Column: Below the Surface
In my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.

Powering the Future: How Packaging Choices Make or Break Performance

03/11/2026 | Brian Buyea -- Column: Powering the Future
When we talk about reliability in electronics, we often focus on the system level: redundancy, fail-safes, or software resilience. But long before the system is assembled or even tested, reliability is considered in materials, metallization, and the packaging process itself. If the foundation isn’t built to survive the environment, no amount of clever design downstream will make up for it.
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