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Advanced Electronics Packaging Digest

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Rocket Lab Acquires Motiv Space Systems, Adding Mars-Proven Robotics Capabilities

05/27/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced it has completed the acquisition of Motiv Space Systems, a California-based company specializing in space robotics, motion control systems, and precision mechanisms for spacecraft.

Is U.S. EMS Growth Real or Just Repositioning?

05/27/2026 | Nolan Johnson, SMT007 Magazine
Based on survey data, U.S. EMS providers are reporting a noticeable uptick in orders, and the narrative forming around what’s driving that growth is familiar: tariffs, reshoring, and a long-awaited revival of domestic manufacturing. Some analysts even claim we’ve entered a super-cycle, a prolonged period of demand-driven economic growth that can last years to decades. But as is often the case in this industry, the reality is more nuanced.

Jabil, ViTrox Strengthen Manufacturing Excellence Through V-ONE Control Tower Digital Factory Collaboration

05/25/2026 | Jabil
ViTrox, which aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, proudly announces the successful integration of the V-ONE Digital Factory Solution into Jabil’s manufacturing workflows.

RTX's Raytheon Completes Design Review of Landsat Next Space Instruments

05/19/2026 | RTX
Raytheon, an RTX business, has successfully completed the preliminary design review for NASA's Landsat Next Instrument Suite (LandIS).

Bold Laser Automation Introduces Thickness Measurement for Inline Web Inspection

05/19/2026 | Bold Laser Automation
Bold Laser Automation announced the launch of its CL1506TP Confocal Differential Thickness Measurement System, a fully integrated inline solution designed to measure web material thickness with high accuracy, stability, and real-time data visibility.
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