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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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My Trip to Schneider Electric: AI, Data, and the Need for More Power

06/02/2026 | Marcy LaRont, I-Connect007
AI is pushing power infrastructure to its limits, and many of those same challenges, particularly around power delivery and heat management, parallel what the electronics industry faces in building and scaling advanced microelectronics. Yet when it comes to AI and hardware, we typically only see a small piece of the total picture. So, when Schneider Electric invited me to tour a modern AI data center still under construction, I jumped at the opportunity. This became a fascinating technical journey I’m excited to share.

Japanese Electronics Giants Eye Investment in Philippine Advanced Manufacturing

06/01/2026 | GOV.PH
Philippine President Ferdinand R. Marcos Jr. secured approximately PhP56.3 billion in potential investments from major Japanese companies during separate meetings on Thursday on the sidelines of his four-day State Visit to Japan.

Schneider Electric Progresses Phased-Delivery of Over $290M in AI Infrastructure Solutions, Including Motivair Technologies, at Terawulf’s Google-Backed Lake Mariner Campus

06/02/2026 | Schneider Electric
Schneider Electric, a global energy technology leader and Motivair by Schneider Electric , a leading innovator in liquid cooling technology for digital infrastructure, today announced the successful phased-delivery of more than $290M in AI infrastructure solutions for TeraWulf’s rapidly expanding Lake Mariner data campus. 

Fresh PCB Concepts: Repair and Risk in Electrical Test Failures in PCB Manufacturing

05/21/2026 | Team NCAB -- Column: Fresh PCB Concepts
Electrical test failures represent one of the most critical decision points in PCB manufacturing because they directly expose defects that affect circuit functionality. Unlike cosmetic anomalies or minor process deviations, these failures indicate that the conductive network defined in the design has not been successfully realized in the finished product. Whether identified through continuity testing, isolation testing, or netlist verification, a failed electrical test confirms that the board cannot perform as intended. At this stage, the question is no longer simply whether a defect exists, but whether it can (or should be) repaired.

Rethinking Reinforcement Materials for Advanced Packaging

05/14/2026 | Ivana Ivanovic, Flexiramics B.V.
Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
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