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"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

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John Andresakis Discusses Integrated Thin-film Resistive Foil Technology

04/10/2026 | Real Time with... APEX EXPO
John Andresakis of Ohmega Ticer shares his advanced solution that offers miniaturization, enhanced electrical performance, and stable resistance for next-generation PCBs. The high-demand applications for high-frequency phased-array antennas in commercial space and military sectors is driving the need for superior RF performance and simplified beam forming.

Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.

Implementing Inkjet Solder Mask: A Customer Success Story

01/13/2026 | Paola Dinelli, KLA
One of the most significant advancements in PCB manufacturing in recent years has been the shift from traditional solder mask processes to digital inkjet technology. This transition offers clear benefits in performance, usability, and production efficiency. This article presents a case study of a PCB manufacturer that successfully implemented inkjet technology for solder mask application, realizing significant gains in quality, cost savings, and yield by overcoming the limitations of traditional methods.

I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future

01/07/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?

Connect the Dots: The Future of Designing for Reality—Outer Layer Imaging

12/24/2025 | Matt Stevenson -- Column: Connect the Dots
If you read my column regularly, you know I’m passionate about helping designers get the most from their designs. In my November column, I focused on designer best practices for the electroless copper component of the manufacturing process. The next step is outer layer imaging: the transition from digital to physical, and where the designer’s IP meets the board.
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