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Marcy’s Musings: Operating Without a Rulebook

04/15/2026 | Marcy LaRont -- Column: Marcy's Musings
What happens when the rulebook is no longer useful, or worse, has not yet been written? With electronics innovation happening at warp speed, we’re increasingly asked to design and build what has no precedent, proven path, or tidy checklist to follow. “Design for invention” begins at the edge of known capability, where traditional DFM gives way to something far less certain, and far more exciting. It’s not about breaking rules for the sake of it; it’s about recognizing when the rules no longer apply and having the insight, collaboration, and courage to move forward anyway.

Keysight, Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation

04/08/2026 | Keysight Technologies, Inc.
Keysight Technologies, Inc., together with Sateliot, has been named a winner of the fifth annual European Space Agency (ESA) and GSMA Foundry Innovation Challenge for its joint project, “Blockchain-enabled anomaly detection end‑to‑end solution for 5G Non‑Terrestrial Networks.”

Wire Harness Taking a Step in the Right Direction

04/08/2026 | Nolan Johnson, SMT007 Magazine
To fully understand the modernization of wire harness design and assembly, we met with members of the Innovation Advisory Team for the Wire Harness Manufacturer’s Association (WHMA) to outline the current challenges facing wire harnesses and the specific steps to implement a digital data flow from OEM to manufacturer and back. In some ways, the wire harness industry is moving from 19th-century to 21st-century technology. But in the meantime, the real challenge isn’t building the harness—manufacturers are very good at that.

IISc, CADFEM & Synopsys Launch Advanced Simulation Center at CeNSE

03/26/2026 | PRNewswire
Ultra-high-speed electronic systems are increasingly shaping the technological frontier across sectors such as aerospace and defence, advanced healthcare, robotics, autonomous mobility, and high-performance computing.

Driving Yield and Reliability: Indium to Present Advanced Semiconductor Packaging Solutions at CPCA 2026

03/20/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging processes at the International Electronic Circuit Exhibition (CPCA), taking place March 24-26 in Shanghai, China.
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