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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Advance Your Electronics Expertise in June and July

05/14/2026 | Global Electronics Association
Stay current with design, manufacturing, and quality standards by enrolling in one of these online instructor-led courses starting in June and July from ElectronicsU at the Global Electronics Association, designed to help professionals at every level sharpen their skills and advance their careers. These live, expert-led sessions combine flexibility with real-time interaction, allowing participants to learn directly from seasoned industry professionals while collaborating with peers worldwide. Access to all applicable IPC standards is included in the courses.

Road to Reliability: Engineering High Uptime EV Charging Infrastructure

05/13/2026 | Stanton Rak, SF Rak Company
The transition to EVs is no longer constrained solely by vehicle capability. Instead, it is increasingly defined by a simpler, but more unforgiving question: Will the charger work when I arrive? This high uptime does not happen by accident. As EV technology has matured, limitations in battery range, power electronics, and thermal management are no longer the primary barriers to adoption.

U.S. Aerospace, Defense Firms Accelerate Digital Strategies

05/13/2026 | BUSINESS WIRE
U.S. aerospace and defense enterprises are adopting integrated digital practices, AI-enabled design and software-centric development approaches as the requirements for competitiveness change, according to a new research report published by Information Services Group (ISG)

PTC Onshape Introduces Direct Altium Integration to Streamline ECAD-MCAD Collaboration

05/12/2026 | PRNewswire
PTC announced a new integration between its cloud-native Onshape® computer‑aided design (CAD) and product data management (PDM) platform and Altium.

I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication

05/13/2026 | I-Connect007
As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
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