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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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QTREX Secures Purchase Order from U.S. Fortune 500 Company for AME System

06/02/2026 | Globe Newswire
QTREX Quantum Ltd.  a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure, announced that it received a purchase order from a Fortune 500 multinational company for an AME system and related materials.

IDI Dynamics Debuts High-Speed Laser Marker for Semiconductor OSAT

05/29/2026 | PRNewswire
IDI Dynamics, a subsidiary of ISDN Holdings Limited, has launched its next generation High-speed Laser Marker for semiconductor chip packages, with a dual value proposition of delivering 2.5x higher marking speed and occupying 22% less physical footprint.

Schneider Electric Progresses Phased-Delivery of Over $290M in AI Infrastructure Solutions, Including Motivair Technologies, at Terawulf’s Google-Backed Lake Mariner Campus

06/02/2026 | Schneider Electric
Schneider Electric, a global energy technology leader and Motivair by Schneider Electric , a leading innovator in liquid cooling technology for digital infrastructure, today announced the successful phased-delivery of more than $290M in AI infrastructure solutions for TeraWulf’s rapidly expanding Lake Mariner data campus. 

Rocket Lab Acquires Motiv Space Systems, Adding Mars-Proven Robotics Capabilities

05/27/2026 | Globe Newswire
Rocket Lab Corporation, a global leader in launch services and space systems, announced it has completed the acquisition of Motiv Space Systems, a California-based company specializing in space robotics, motion control systems, and precision mechanisms for spacecraft.

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

05/27/2026 | BUSINESS WIRE
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.
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