Marcy’s Musings: From Business Diversification to Designing Display Electronics
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The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.
Chetan Patil explores how AI accelerator packages are reshaping traditional assumptions about semiconductor design. While transistor scaling has driven computing advances for decades, today’s AI workloads place unprecedented demands on package-level power delivery and thermal management. Patil explains why modern packages have evolved from passive electrical interfaces into active performance enablers that determine how efficiently next-generation processors operate.
The issue also examines the infrastructure supporting AI's explosive growth. During a visit to Schneider Electric's liquid cooling operations in Buffalo, New York, Marcy LaRont speaks with Andrew Bradner, senior vice president of the cooling business, about how AI has fundamentally changed data center architecture. Their discussion covers the rapid adoption of liquid cooling, the increasing demands placed on supporting electronics, and the broader implications for manufacturers across the advanced electronics supply chain.
Chandra Gupta, business development director at Remtec, challenges engineers to reconsider how substrate materials are selected. Gupta argues that material choice directly affects system reliability, thermal performance, and lifecycle cost, particularly in high-power, high-frequency, and mission-critical applications. His article explains why ceramic substrates are gaining attention as designers push beyond the practical limits of conventional FR-4.
Substack subscribers will receive early access to the issue on July 17, with distribution to the I-Connect007 subscriber audience beginning July 20.
