-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 1 minute
Contact Columnist Form
How Electromagnetic Fields Determine Impedance, Part 1
We talk a lot about trace dimensions and relationships when discussing signal integrity issues. In particular, we like to talk about how close traces are to underlying planes and how close traces are to each other. But there is another way to think about things that is sometimes much more practical and intuitive, and that is by thinking about the electromagnetic field around the trace(s) we are considering. The position and shape of the electromagnetic field can tell us a lot about trace impedance, EMI and crosstalk coupling, and signal propagation speed.
When a current flows down a conductor an electric field and a magnetic field radiates away from that conductor. Collectively, this is called the electromagnetic field. What is important to note is that this field always exists. Furthermore, the electromagnetic field and the current are inseparable. That is: (a) the electric field can’t move ahead of the magnetic field; (b) the magnetic field can’t move ahead of the electric field; and (c) neither field can get ahead of or fall behind the current itself. They all have to move together along the conductor.
Read the full column here.
Editor's Note: This column originally appeared in the August 2013 issue of The PCB Design Magazine.
More Columns from Brooks' Bits
Brooks' Bits: Internal Trace Temperatures—More Complicated Than You ThinkBrooks' Bits: Electromagnetic Fields, Part 3 - How They Impact Coupling
Brooks' Bits: Electromagnetic Fields, Part 2: How They Impact Propagation Speed
Brooks' Bits: How Electromagnetic Fields Determine Impedance, Part 1
Trace Currents and Temperature, Part 4: Via Heat
Trace Currents and Temperature, Part 3: Fusing Currents
Trace Currents and Temperature, Part 1: The Basic Model
The Skinny on Skin Effect, Part 3: Crossover Frequency