Opportunities for 3D Printed Structural Electronics
January 28, 2015 | Dr. Jon Harrop, IDTechExEstimated reading time: 1 minute
3D printing refers to the physical construction of an object from a digital description through the selective deposition of material. Today’s 3D printers have many limitations, but the boundaries are being pushed and exciting developments are continuously being made. One of the most promising recent developments in the world of 3D printing is multimaterial printing, not least because it is the key to the emergence of 3D printed electronics. Today’s commercially available multimaterial 3D printers are limited to providing a variety of mechanical characteristics such as rigidity as well as color and transparency, but the seemingly simple inclusion of UV curable conductive inks could make these machines capable of manufacturing objects that contain conductive traces.
This is naturally regarded by many as a direct alternative to traditional PCB manufacture and, in many respects, not a very good one. The logical application for 3D PCBs plays to the traditional strengths of 3D printing: rapid prototyping. However, the ability to lay down conductive traces inside a 3D object has far more potential. There is no longer any requirement to use flat designs. The added design freedom has the potential to greatly simplify circuit layout but will require a new generation of software tools. Furthermore, the natural evolution of this design freedom is the ability to embed electronics in the structure of anything. This is known as structural electronics.
Structural electronics is one of the most important technological developments of this century. It forms a key part of the dream, first formulated 30 years ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed. Structural electronics is often biomimetic—it usefully imitates nature in ways not previously feasible.
Suggested Items
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.