It’s Only Common Sense Mastering the Follow-Up—The Key to Closing More Deals
Driving Innovation: Registration in PCB Production Throughout the Process
Dan's Biz Bookshelf: 'Getting Naked: A Business Fable'
GIA: Multi-core Processor Market to Reach $116.3B by 2020
June 18, 2015 | Global Industry Analysts Inc.Estimated reading time: 1 minute
The global market for multi-core processors is projected to reach $116.3 billion by 2020, driven by rising demand for faster computing speeds, and spiraling sales of portable computing devices, according to a new report by market analyst firm Global Industry Analysts Inc. (GIA).
Multi-core architectures are gaining prominence in the semiconductor and electronics industries, with new smartphones featuring dual, triple, quad, and octa core processors. With consumers and businesses demanding enhanced computing performance from their devices, semiconductor companies are migrating to multi-core processors as an alternative to single core processing systems.
A key factor driving smartphone processing speeds is the evolution of smartphones into personal organizers, music players, game consoles, video players, and web browsers. The resulting need for superior image and data processing is driving adoption of multi-core processors.
The transition of chip designs to multi-core processing architectures has facilitated considerable improvements in product performance, while simultaneously cutting down cost of production. Multi-core technology is particularly useful when dealing with demanding tasks and applications such as 3D gaming, video editing and encoding. Multi-core technology’s ability to bring about incremental improvements in power and speed of processing for a range of applications and services, while also offering advanced management and control capabilities constitutes a key factor fuelling its adoption in various end-use verticals.
Key end-use sectors poised to generate strong demand for multi-core processors include consumer electronics, transportation, automotive, industrial, medical, and communications. In the coming years, industrial automation, healthcare, automotive and energy sectors are expected to generate significant demand for multi-core processors. However, while multi-core processors significantly improve the performance of a device, the extent of such improvements depends on the type of software algorithm used and its implementation.
Share on:
Suggested Items
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025
04/29/2025 | congateccongatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.