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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Marvell Advances AI Memory Infrastructure Portfolio to Accelerate Agentic AI Inference

08/14/2026 | Marvell Technology, Inc.
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced new innovations across its AI memory infrastructure portfolio, advancing its position spanning server-level AI storage, rack-scale CXL memory expansion and pooling, and pod-level optical shared memory.

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/13/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/13/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.

Polar's Speedstack Eases Material Identification and Adds Ventec Glass-Free Materials

08/10/2026 | Polar Instruments
Polar’s Speedstack mid-year release adds Ventec Glass-Free materials to online resources, and incorporates improved capability of identifying multi material families in the stack documentation, giving users “at a glance” visual views of material types in a stack.
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