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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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The Chemical Connection: More Solutions to Common PCB Etching Questions

09/09/2026 | Don Ball -- Column: The Chemical Connection
Rather than pontificating at great length on a subject I know nothing about, although I have been known to do this on occasion (the scientific term for this is “baffling them with bull****”), I decided to comment on some basic questions and problems that keep popping up in spite of them having been around forever and having known solutions. Most of the inquiries come from the new process engineers who are being promoted as the older, more experienced process engineers retire. They’re so basic that the older people don’t even think about them anymore, let alone pass the knowledge on, so when these questions or problems arise, the new people are unaware that there are explanations and/or solutions.

RTX's Raytheon Completes Installation of First SPY-6(V)4 Array at Wallops Island Test Site

08/03/2026 | Raytheon Company
Raytheon, an RTX business, has delivered and installed the first SPY-6(V)4 radar array at Surface Combat Systems Center at Wallops Island in Virginia, marking a major milestone for the U.S. Navy's Flight IIA Destroyer modernization effort and the SPY-6 backfit program.

Henniker Plasma Targets Throughput and Process Stability with Stratus Manufacturing Solution

07/20/2026 | Henniker Plasma
Manufacturers scaling a bonding, coating or printing process to full production rarely struggle with the science of surface treatment; they struggle with holding it steady, line after line, shift after shift.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

07/07/2026 | Remtec
Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.
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