Cambridge Nanotherm Named Finalist of the 2015 R&D 100 Awards
August 11, 2015 | Cambridge NanothermEstimated reading time: 3 minutes
Cambridge Nanotherm, a producer of innovative nanoceramic thermal management technology, has been named as a finalist in the R&D 100 Awards, otherwise known as the “Oscars of Invention.” Since 1963 the R&D 100 Awards have identified revolutionary technologies newly introduced to the market. Previous winners have been as diverse as the photo flashcube, the ATM and high-definition TV.
The Haverhill-based team was selected by an independent judging panel and the editors of R&D Magazine for its Nanotherm DM technology in the "Mechanical Devices and Materials" category. Cambridge Nanotherm are the only British company to be named in this category and are competing against some of the biggest names in tech, with the likes of MIT, The Dow Chemical Company and Toyota Motor Corporation all in the running.
Making the finals of the R&D 100 Awards highlights the radical shift in thermal management technology that has been achieved by Cambridge Nanotherm. Using a patented process, the surface of aluminium is converted to form a nanoceramic dielectric with exceptional thermal properties. The nanoceramic is circuitised using thin-film techniques to produce Nanotherm DM, a material with properties that rival exotic ceramics but at a fraction of the price. Initially targeted at the chip-on-board and LED packaging markets Nanotherm DM allows LED manufacturers to make significant cost savings without impacting the performance of their products.
“We are proud to have been recognised as leading material innovators for this prestigious R&D award. The nomination is testament to the hard work and dedication of Cambridge Nanotherm’s product development team.” Ralph Weir, CEO of Cambridge Nanotherm commented. “The unique characteristics Nanotherm DM brings to the market are truly groundbreaking. It has the potential to transform thermal management in the LED and wider electronics industry.”
The nomination arrives at a time when the LED market is undergoing fundamental changes. Advances in packaging technologies are enabling companies to pack more power into smaller form factors and this is driving up the temperature of LEDs. Thermal management is becoming one of the major challenges for the industry to overcome. The opportunity for Cambridge Nanotherm’s technology in this market is enormous, as improved thermal efficiency has the potential to offer a major competitive advantage.
The winners of the 2015 R&D 100 Awards will be announced on the 13th of November at the R&D gala banquet at Caesars Palace, Las Vegas, Nevada.
More information on the R&D 100 Awards can be found here. A full list of finalists is available here.
About Cambridge Nanotherm Ltd.
Cambridge Nanotherm’s substrates for LED applications and high powered electronics provide the industry’s best thermal performance/price ratio available today. Nanotherm LC substrates are used by LED manufacturers to reduce costs, improve lifetime and increase the brightness of their products. Electronic power and control modules benefit from closer component spacing, higher electrical ratings and improved reliability.
A patented process creates a super-thin nano-ceramic layer on the surface of aluminium to form a dielectric with extremely high thermal conductivity. This nanoceramic can be applied as thin as 3µm – many times thinner than conventional dielectrics. The combination of the thinnest dielectric layer in the industry with the highest thermal conductivity yields the lowest thermal resistance of any Metal Clad PCB material.
A second product, Nanotherm DM, can replace expensive aluminium nitride sub-mounts by achieving similar thermal performance while retaining the robustness and ease of processing of an insulated metal substrate.
Cambridge Nanotherm was set up in 2010 by an experienced team of managers with a strong track record for commercialising innovative IP, and is backed by Enso Ventures.
For further information visit www.camnano.com/
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.