Cambridge Nanotherm Named Finalist of the 2015 R&D 100 Awards
August 11, 2015 | Cambridge NanothermEstimated reading time: 3 minutes
Cambridge Nanotherm, a producer of innovative nanoceramic thermal management technology, has been named as a finalist in the R&D 100 Awards, otherwise known as the “Oscars of Invention.” Since 1963 the R&D 100 Awards have identified revolutionary technologies newly introduced to the market. Previous winners have been as diverse as the photo flashcube, the ATM and high-definition TV.
The Haverhill-based team was selected by an independent judging panel and the editors of R&D Magazine for its Nanotherm DM technology in the "Mechanical Devices and Materials" category. Cambridge Nanotherm are the only British company to be named in this category and are competing against some of the biggest names in tech, with the likes of MIT, The Dow Chemical Company and Toyota Motor Corporation all in the running.
Making the finals of the R&D 100 Awards highlights the radical shift in thermal management technology that has been achieved by Cambridge Nanotherm. Using a patented process, the surface of aluminium is converted to form a nanoceramic dielectric with exceptional thermal properties. The nanoceramic is circuitised using thin-film techniques to produce Nanotherm DM, a material with properties that rival exotic ceramics but at a fraction of the price. Initially targeted at the chip-on-board and LED packaging markets Nanotherm DM allows LED manufacturers to make significant cost savings without impacting the performance of their products.
“We are proud to have been recognised as leading material innovators for this prestigious R&D award. The nomination is testament to the hard work and dedication of Cambridge Nanotherm’s product development team.” Ralph Weir, CEO of Cambridge Nanotherm commented. “The unique characteristics Nanotherm DM brings to the market are truly groundbreaking. It has the potential to transform thermal management in the LED and wider electronics industry.”
The nomination arrives at a time when the LED market is undergoing fundamental changes. Advances in packaging technologies are enabling companies to pack more power into smaller form factors and this is driving up the temperature of LEDs. Thermal management is becoming one of the major challenges for the industry to overcome. The opportunity for Cambridge Nanotherm’s technology in this market is enormous, as improved thermal efficiency has the potential to offer a major competitive advantage.
The winners of the 2015 R&D 100 Awards will be announced on the 13th of November at the R&D gala banquet at Caesars Palace, Las Vegas, Nevada.
More information on the R&D 100 Awards can be found here. A full list of finalists is available here.
About Cambridge Nanotherm Ltd.
Cambridge Nanotherm’s substrates for LED applications and high powered electronics provide the industry’s best thermal performance/price ratio available today. Nanotherm LC substrates are used by LED manufacturers to reduce costs, improve lifetime and increase the brightness of their products. Electronic power and control modules benefit from closer component spacing, higher electrical ratings and improved reliability.
A patented process creates a super-thin nano-ceramic layer on the surface of aluminium to form a dielectric with extremely high thermal conductivity. This nanoceramic can be applied as thin as 3µm – many times thinner than conventional dielectrics. The combination of the thinnest dielectric layer in the industry with the highest thermal conductivity yields the lowest thermal resistance of any Metal Clad PCB material.
A second product, Nanotherm DM, can replace expensive aluminium nitride sub-mounts by achieving similar thermal performance while retaining the robustness and ease of processing of an insulated metal substrate.
Cambridge Nanotherm was set up in 2010 by an experienced team of managers with a strong track record for commercialising innovative IP, and is backed by Enso Ventures.
For further information visit www.camnano.com/
Suggested Items
Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab
11/27/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight
11/26/2024 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.
SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
11/26/2024 | SMTAThe SMTA is excited to announce the technical program for the second annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Plasmatreat Expands its International Network and Opens a Subsidiary in Mexico
11/26/2024 | PlasmatreatOn-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another branch in Querétaro, Mexico, to provide even better and more direct support to users and interested parties of atmospheric pressure plasma technology. Plasmatreat continues to expand its international network.