New Material Science Research May Advance Tech Tools
September 1, 2015 | LSUEstimated reading time: 1 minute
Hard, complex materials with many components are used to fabricate some of today’s most advanced technology tools. However, little is still known about how the properties of these materials change under specific temperatures, magnetic fields and pressures. Researchers from LSU, Fudan University, the University of Florida and the Collaborative Innovation Center of Advanced Microstructures in Nanjing, China, conducted research on materials that separate into different regions through a process called electronic phase separation, which is poorly understood. Their research advances the understanding of how these materials can be manipulated without having to discover new materials, change the chemical concentration or apply external magnetic fields. Their research was published in the Proceedings of the National Academy of Sciences.
The researchers manipulated a steel gray mineral called manganite, which is used to build magnetic hard discs in computers. They created holes, or antidots, in thin films of manganite. It was discovered that the edges of the antidots were magnetic.
“The discovery of the magnetic edge states on the antidots made this work possible. Nobody had ever seen this before,” said LSU Physics Professor Ward Plummer, a co-author on the study.
The magnetic phase state at the edges of the antidots raised the metal-to-insulator phase transition temperature of the manganite film. The researchers were able to replicate this through simulations.
“People have really tried to increase the temperature and reduce the operating field or tried to change the substrate or chemical composition. But we find this new approach with antidots to be quite useful,” said Jian Shen, head of the Department of Physics at Fudan University and a co-author on the paper.
“What you really would like to do is get this temperature above room temperature, so you can switch the material by using a magnetic field,” Plummer said.
This study is part of an on-going collaboration between Plummer and Shen. They began to work together on manganite systems with higher temperatures and lower magnetic fields in 1998 at Oak Ridge National Laboratory. This project continues with funding from the Department of Energy.
Suggested Items
2024 Apple iPad Pro Estimated to Ship Between 4.5 to 5 Million Units
05/08/2024 | TrendForceApple’s recent product launch in May introduced a lineup of new tablets featuring advanced AMOLED screens. Notably, the Pro version boasts a dual-layer tandem structure designed to address the longstanding challenges of screen burn-in and lifespan that are common with AMOLED displays.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.
05/02/2024 | PRNewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.