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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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Eurocircuits Issues Customer Testimonial on Ucamco's Ledia
September 16, 2015 | UcamcoEstimated reading time: Less than a minute
In January 2015, Eurocircuits, a leading European PCB prototype manufacturer, purchased a Ledia SD direct imager from Ucamco for its manufacturing facility in Eger (Hungary).
“Conventional phototool-based exposure are very expensive for us, because we use the films to make relatively small numbers of panels, yet we can't re-use them," said Luc Smets, managing partner at Eurocircuits. "We realised some years ago that DI would eliminate our film costs, and so we started tracking our materials and processing costs vs. the costs of investment in the technology. Last year, the numbers finally made sense: DI systems costs had decreased sufficiently, and at our Eger plant alone, we used a record 36,000 films for inner and outer layers, and 25,000 films for soldermask. It was time to make the switch."
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