American Standard Circuits Taking Business to New Heights
November 3, 2015 | Patty Goldman, I-Connect007Estimated reading time: 9 minutes
Vardya: The other thing that we've also recently implemented is a software package called TrueChem to control all our lab chemistries. We now have a dashboard that anybody can go to. They can know exactly where we are on our analyses, if we're falling a little behind, or if somebody hasn't made the adds.
All of that information is very visible, and we're also able to control chart all of our chemistries now, so we've seen much better control of our processes. We've also seen, whenever we have any kind of a technical issue, or a scrap issue, they're quickly able to go back to what tanks in the process may have a problem and look at what state of affairs the chemistries were in. We’ve got better traceability.
Goldman: That's the byword for many of your customers, too, I'm sure. They all want traceability.
Vardya: Correct. We've also made some pretty significant investments in terms of capital equipment. Earlier this year, we had a bought an AccuScore machine to improve our scoring capabilities. Recently, we've also invested in what I would call a high aspect ratio hole cleaner. It cleans up the debris that's inside the holes after drilling. It's very high pressure, it's meant for high aspect ratios, and it's a custom-designed machine where we're working with someone to do that. It's a combination wet and dry process; it’s a blow-off, and followed by a very high pressure rinse.
We've upgraded our inkjet printer to the latest Orbotech Sprint 120. We've also invested in a Pluritec X-ray drill machine. We already have X-ray drill capability, but this is adding capacity, and also getting us the latest in drilling technology. Our current X-ray is dated, so it's only so good. This has much better capabilities, especially for the higher layer counts, and the mixed materials that we're pursuing.
Then, our largest investment this year has been an Orbotech LDI machine that actually just came into our facility today. It's been a very busy year for us at American Standard.
Goldman: A really exciting year. You must be very busy and that's great to hear. A lot of positive stuff coming out, and a lot of growth-related stuff, so that's all good news. I presume your customers love this.
Vardya: Yes, it's great news for us. But to be honest with you, we are just starting to tell our customers the whole story of what we're doing, but they're absolutely going to be very happy with us, given the investments we're making.
Goldman: Yes, because you keep up with them. They put out new designs, and nothing gets simpler, it always gets more complicated, and you are keeping up with all of that. That's fantastic. Anaya, thanks so much for spending some time with me today.
Vardya: Thank you, Patty.
Page 3 of 3Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.