Invention of Forge-proof ID to Revolutionise Security
November 13, 2015 | Lancaster UniversityEstimated reading time: 2 minutes
Scientists have discovered a way to authenticate or identify any object by generating an unbreakable ID based on atoms.
The technology, which is being patented at Lancaster University and commercialised through the spin-out company Quantum Base, uses next-generation nanomaterials to enable the unique identification of any product with guaranteed security.
The research published today in Nature’s Scientific Reports uses atomic-scale imperfections that are impossible to clone as they comprise the unmanipulable building blocks of matter.
First author Jonathan Roberts, a Lancaster University Physics PhD student of the EPSRC NOWNANO Doctoral Training Centre, said: “The invention involves the creation of devices with unique identities on a nano-scale employing state-of-art quantum technology. Each device we’ve made is unique, 100% secure and impossible to copy or clone.”
Current authentication solutions such as anti-counterfeit tags or password-protection base their security on replication difficulty, or on secrecy, and are renowned for being insecure and relatively easy to forge. For example, current anti-counterfeiting technology such as holograms can be imitated, and passwords can be stolen, hacked and intercepted.
The ground-breaking atomic-scale devices do not require passwords, and are impervious to cloning, making them the most secure system ever made. Coupled with the fact that they can be incorporated into any material makes them an ideal candidate to replace existing authentication technologies.
Writing in Nature’s Scientific Reports, the researchers said: “Simulating these structures requires vast computing power and is not achievable in a reasonable timescale, even with a quantum computer. When coupled with the fact that the underlying structure is unknown, unless dismantled atom-by-atom, this makes simulation extremely difficult.
Electronically stimulating an atomically random system, represented above by a key, produces a unique pattern that can be used for authentication or identification purposes whilst being fundamentally unclonable.
Page 1 of 2
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
The Missing Connection: Wire Harness Quoting Joins the Digital Age
05/01/2026 | Joanne Harris, Tech-2marketingWalk the floor of a modern wire harness manufacturing facility, and the investment in technology is hard to miss. Automated wire cutting and stripping machines process thousands of cuts an hour with sub-millimeter precision. Computerized crimping presses deliver consistent, validated terminations that a hand tool never could. Laser wire markers, automated test benches, and vision-guided assembly stations represent hundreds of thousands of dollars of capital investment, all in service of building a better harness faster and more reliably than the competition.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
05/01/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.