Structural Electronics 2015-2025 Report
November 18, 2015 | PRNewswireEstimated reading time: 1 minute
Structural electronics (SE) is one of the most important technological developments of this century. It forms a key part of the dream, formulated decades ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed. SE is often biomimetic - it usefully imitates nature in ways not previously feasible. It is a rapidly growing multi-billion dollar business.
Structural electronics involves electronic and/or electrical components and circuits that act as load-bearing, protective structures, replacing dumb structures such as vehicle bodies or conformally placed upon them. It is of huge interest to the aerospace industry which is usually the first adopter, the automotive industry and in civil engineering both with compelling needs but its reach is much broader even than this. Electric cars badly need longer range and more space for the money and, in civil engineering, corrosion of reinforced concrete structures and tighter requirements for all structures, including early warning of problems, are among the market drivers for structural electronics.
The common factor is that both load bearing and smart skin formats occupy only unwanted space. The electronics and electrics effectively have no volume. More speculatively, electronics and electrics injected into unused voids in vehicle bodies, buildings etc., say as aerogel, could also provide this benefit without necessarily being load bearing but possibly providing other benefits such as heat insulation. Some present and future applications of structural electronics are morphing aircraft using shape memory alloys, car with printed organic light emitting diode OLED lighting on outside and inside of roof and printed photovoltaics over the outside generating electricity supercapacitor skin on an electric car replacing the traction battery as energy storage, smart skin as a nervous system for an aircraft and solar boats and aircraft running on sunshine alone. In London, a piezoelectric smart dance floor generates electricity and smart bridges across the world have sensors and more embedded in their concrete, all forms of structural electronics as it is increasingly the way to go.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.