It’s Only Common Sense: Invest in Yourself—You’re Your Most Important Resource
Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Catching Up with Circuit Connect
November 19, 2015 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 9 minutes
Circuit Connect: We are in the planning stages of setting up on-site seminars and what we call Lunch & Learns, as well as tours so that people can come and learn more about our technology. We want to be a true industry resource. In terms of the future of the industry, that goes hand in hand with what we have been talking about. If we are going to progress and continue to build cutting-edge products, then we are going to have to work together. Look, there is no doubt that this is still the most innovative country in the world, with the most new and innovative product-seeking consumers and we have to take advantage of that. We have to work together, pushing all of our technology envelopes, whatever our products are, to make sure that we are always at the very top of the technology curve.
Dan: Okay, does that mean all new equipment?
Circuit Connect: In some cases, yes. Certainly in terms of the new LDIs and systems like that, new equipment is on the horizon for us as it is for all board shops. But let’s not forget ingenuity. I guess being here in New England, we like to claim it as good old “Yankee ingenuity,” which means finding a way with what you have on hand. We do a lot of that here at Circuit Connect. We find new ways to do things using the technology we have already and, yes, it does work.
Dan: Well guys, thanks for spending so much time with me today. It has been fascinating to say the least.
Circuit Connect: It’s been our pleasure, Dan. We’re willing to do this any time. Like we said, we want to educate people on what we are doing here. Let them know that they can come here with their new products and we’ll do everything we can to support and help them create the best product that can be built today.
Page 3 of 3Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.