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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Catching Up with Circuit Connect
November 19, 2015 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 9 minutes
Circuit Connect: We are in the planning stages of setting up on-site seminars and what we call Lunch & Learns, as well as tours so that people can come and learn more about our technology. We want to be a true industry resource. In terms of the future of the industry, that goes hand in hand with what we have been talking about. If we are going to progress and continue to build cutting-edge products, then we are going to have to work together. Look, there is no doubt that this is still the most innovative country in the world, with the most new and innovative product-seeking consumers and we have to take advantage of that. We have to work together, pushing all of our technology envelopes, whatever our products are, to make sure that we are always at the very top of the technology curve.
Dan: Okay, does that mean all new equipment?
Circuit Connect: In some cases, yes. Certainly in terms of the new LDIs and systems like that, new equipment is on the horizon for us as it is for all board shops. But let’s not forget ingenuity. I guess being here in New England, we like to claim it as good old “Yankee ingenuity,” which means finding a way with what you have on hand. We do a lot of that here at Circuit Connect. We find new ways to do things using the technology we have already and, yes, it does work.
Dan: Well guys, thanks for spending so much time with me today. It has been fascinating to say the least.
Circuit Connect: It’s been our pleasure, Dan. We’re willing to do this any time. Like we said, we want to educate people on what we are doing here. Let them know that they can come here with their new products and we’ll do everything we can to support and help them create the best product that can be built today.
Page 3 of 3Suggested Items
Trouble in Your Tank: Can You Drill the Perfect Hole?
07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.