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Semblant to Exhibit at the International Printed Circuit & APEX South China Fair
November 24, 2015 | MarketwiredEstimated reading time: 1 minute
Semblant, the market leader in protective nanocoatings and liquid damage prevention for electronic devices, in partnership with Nordson March and Unite-Effort, today announced that it will demonstrate its high-volume equipment solutions that are widely deployed in the protection of mobile phones and other consumer electronic devices.
"China is the center of the world for mobile devices," said Simon McElrea, CEO, Semblant. "The top Chinese OEMs are growing rapidly as they penetrate overseas markets, and the rest of the world builds their phones here. Semblant already has a very broad base of installed nanocoating capacity in multiple factories in China, and we are delighted to demonstrate our groundbreaking technology at the South China Fair."
The companies will exhibit in booth 1B27 at the International Printed Circuit & APEX South China Fair taking place Dec. 2-4, 2015 at the Shenzhen Convention & Exhibition Center in Shenzhen, China. Now in its 13th year, the International Printed Circuit & APEX South China Fair is the world's largest printed circuit board and electronic assembly show. The show offers a highly influential platform for networking, sourcing, exchanging technology and keeping up to date on industry trends.
About Semblant
Semblant is the global leader in innovating and deploying nanomaterials in the electronics industry. The company's unique nanotechnology solutions, backed by a broad range of fundamental patents, have been designed specifically to protect electronic devices from liquid ingress, corrosion and many other forms of damage. With thicknesses in the submicron range, Semblant's proprietary plasma-based conformal coatings and protective surface treatments provide remarkable improvements in product reliability, product lifetime, return/repair/resale economics and customer brand loyalty. The company's proprietary equipment sets are cleanroom compliant, high-volume-manufacturing-proven (greater than 1 million units per day capacity installed), and the resulting materials are entirely reworkable (solder-through) and ultra-green (including PFOA- and PFOS-free). To date, the company has provided solutions to the mobile phone, wearable, enterprise computing, network infrastructure, medical device, automotive and space-military-aerospace markets, as well as the printed circuit board and semiconductor/semiconductor packaging industries.
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