Stanford Technology Makes Metal Wires on Solar Cells Nearly Invisible to Light
November 26, 2015 | Stanford UniversityEstimated reading time: 4 minutes
The solution: Create nanosized pillars of silicon that "tower" above the gold film and redirect the sunlight before it hits the metallic surface.
Creating silicon nanopillars turned out to be a one-step chemical process.
"We immersed the silicon and the perforated gold film together in a solution of hydrofluoric acid and hydrogen peroxide," said graduate student and study co-author Thomas Hymel. "The gold film immediately began sinking into the silicon substrate, and silicon nanopillars began popping up through the holes in the film."
Within seconds, the silicon pillars grew to a height of 330 nanometers, transforming the shiny gold surface to a dark red. This dramatic color change was a clear indication that the metal was no longer reflecting light.
"As soon as the silicon nanopillars began to emerge, they started funneling light around the metal grid and into the silicon substrate underneath," Narasimhan explained.
He compared the nanopillar array to a colander in your kitchen sink. "When you turn on the faucet, not all of the water makes it through the holes in the colander, " he said. "But if you were to put a tiny funnel on top of each hole, most of the water would flow straight through with no problem. That's essentially what our structure does: The nanopillars act as funnels that capture light and guide it into the silicon substrate through the holes in the metal grid."
Big boost
The research team then optimized the design through a series of simulations and experiments.
"Solar cells are typically shaded by metal wires that cover 5-to-10 percent of the top surface," Narasimhan said. "In our best design, nearly two-thirds of the surface can be covered with metal, yet the reflection loss is only 3 percent. Having that much metal could increase conductivity and make the cell far more efficient at converting light to electricity."
For example, this technology could boost the efficiency of a conventional solar cell from 20 percent to 22 percent, a significant increase, he said.
The research team plans to test the design on a working solar cell and assess its performance in real-world conditions.
Covert contacts
Besides gold, the nanopillar architecture will also work with contacts made of silver, platinum, nickel and other metals, said graduate student and co-author Ruby Lai.
"We call them covert contacts, because the metal hides in the shadows of the silicon nanopillars," she said. "It doesn't matter what type of metal you put in there. It will be nearly invisible to incoming light."
In addition to silicon, this new technology can be used with other semiconducting materials for a variety of applications, including photosensors, light-emitting diodes and displays, transparent batteries, as well as solar cells.
"With most optoelectronic devices, you typically build the semiconductor and the metal contacts separately," said Cui, co-director of the Department of Energy's Bay Area Photovoltaic Consortium (BAPVC). "Our results suggest a new paradigm where these components are designed and fabricated together to create a high-performance interface."
Page 2 of 2Suggested Items
STMicroelectronics, Metalenz Sign a New License Agreement to Accelerate Metasurface Optics Adoption
07/14/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
SMTA Releases Final Batch of Training Resources Donated by Bob Willis
05/29/2025 | SMTAThe Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.