MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI
December 14, 2015 | Patty Goldman, I-Connect007Estimated reading time: 8 minutes
Nable: Every day is exciting. All we know is also what’s been publicly announced. As far as technical people like us are concerned, before or after the announcements, it doesn't change our daily responsibilities. We still work on solving technical problems. We try to come up with innovative solutions for our customers.
Goldman: It doesn't change what you're doing. You might just have a broader audience later on. As researchers, do you get out in the field much to work with customers?
Nable: Not so much. On occasion, if needed, we do go out in the field to provide support.
Santos: It's mostly the process specialists that go into the field. Once in a while, if the formulator needs to be in the field, then we may be called upon.
Goldman: Now, when your new processes first go to a customer, will you go with them for the very first tests and all that?
Santos: If necessary, we do provide support. The process specialist takes over when the product goes to the field. Bringing a product to the field is a long process. It starts with the researcher working on the formulation. If the formula is ready for scale up, let’s say from a liter beaker to a 50-liter tank, the process specialist then becomes heavily involved. When we scale up at our Waterbury site, both researcher and process specialist work together. We assess the performance and resolve issues we encounter until we meet all the requirements. When the product is brought to the field, the process specialist already has an idea and background of the requirements, performance, etc.
Goldman: Thanks so much for your time, and best of luck with both of your projects going forward.
Nable: Thank you.
Page 4 of 4Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.