Global Camera Module Industry Report
December 29, 2015 | Business WireEstimated reading time: 1 minute
Research and Markets has announced the addition of the "Camera Module Industry 2015 - Mobile CCM Technology Review - Reverse Technology Report"report to their offering.
Smartphone camera usage changed the equilibrium within consumer electronics, disrupting the digital still camera (DSC) market. Smartphones have taken a major share of the industry, but automotive is the new background industry for camera modules.
In addition to Yole Développement Camera Module Industry 2015 report, this comparative technologies review has been conducted to provide insight on structure and technology for 17 CMOS Camera Modules (CCM) released in flagship smartphones from the major brands. Both rear and front-facing CCM are compared in term of structure overview, module integration, lenses number and dimensions, CIS resolution, pixel size For comparative purpose, an analysis of two automotive camera modules has been realized to highlight the main differences.
Mobile is the main driver for technology, asking for more performance in a constrained footprint. This report shows the technology choices of the main players.
Sensor technology has been transformed by BSI and Stacked BSI technologies. The race for decreasing pixel size goes hand in hand with increasing resolution. Surprisingly, market demand is pushing technology so that optical formats are actually increasing, resulting in a module price increase.
Optics have increased in complexity with decreasing F numbers, increasing field view (FOV) and therefore number of lens. Due to high resolution and low F number, auto focus (AF) and image stabilization (OIS) now become mandatory.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.