Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
2015’s Most Read PCB Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
EIPC Summer Conference, Berlin
The 2015 EIPC Summer Conference attracted delegates to Berlin from sixteen countries to experience 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organization.
HDPUG Demonstrates Benefits of Cooperative R&D
The High-Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Characterization of PCB Material & Manufacturing Technology for High-Frequency
Concepts like Industry 4.0, Internet of Things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement— a considerable amount of data and increased data transfer rate. the aim of this paper is to develop a concept to use materials in combination with optimized pcB manufacturing processes, which allows a significant reduction of losses and increased signal quality.
Page 1 of 2
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Innovating Design—IPC's Vision for the Future
04/09/2025 | Real Time with...IPC APEX EXPOPeter Tranitz leads the IPC Design Initiative, which aims to enhance design offerings and engage the community, including the Design Leadership Council guiding future strategies. Peter talks about the IPC-hosted European electronics design conference, featuring peer-reviewed content and global participation. IPC's design initiative also tackles challenges, such as semiconductor scaling and AI integration, focusing on innovative co-design solutions.
Tariff Uncertainty Weighs on Display Demand, Pricing, and the Supply of AMOLED Materials,
04/09/2025 | TrendForceTrendForce reports that the U.S. began implementing reciprocal tariffs on April 9th, based largely on trade deficits. Consequently, Asia—particularly Southeast Asia, a key hub for the consumer electronics supply chain—has been significantly impacted.
Real Time with... IPC APEX EXPO 2025: Exploring Ventec's Innovations
04/09/2025 | Real Time with...IPC APEX EXPOMark Goodwin highlights Ventec's global distribution network and recent expansions in service and equipment offerings. He emphasizes the company's expertise in coating technology for thermal management, specialized materials, and its agility in creating customized solutions for customers.
Incap US Invests in Advanced SMT Technology
04/09/2025 | IncapIncap Electronics US invested approximately USD 2 million (EUR 1.82 million) in advanced SMT (surface-mount technology) production equipment to expand its production capacity.
Real Time with... IPC APEX EXPO 2025: Navigating Economic Headwinds in the Electronics Industry
04/08/2025 | Real Time with...IPC APEX EXPOShawn DuBravac, IPC Chief Economist, highlights the industry's resilience amid economic challenges, noting ongoing investment despite uncertainty and rising interest rates. Consumer behavior shows caution, with slowing spending and weakening confidence. A global economic overview reveals strengths in the U.S., challenges in China, and struggles in Europe. The discussion emphasizes the negative impact of tariffs and the importance of resilient supply chains.