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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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2015’s Most Read PCB Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. that is why 22 IPC member-company executives descended on the nation’s capital for IMpact 2015: Ipc on capitol hill, IPC’s annual advocacy event.
A Cautionary Tale: Counterfeit Materials
John Ling of EIPC writes, “Risk from counterfeits wears many hats. There is reputational risk, which can be damaging; there is inherent safety risk, which could be fatal; and there is financial risk to the OEM, the PCB manufacturer, and the PCB broker. One way of minimizing risk is by dealing direct.”
Institute of Circuit Technology 41st Annual Symposium
ICT technical director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of circuit technology annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in the home of the original Industrial Revolution.
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Missile Strike on Ukraine Hits Flex Facility
08/22/2025 | FlexOn the morning of August 21, 2025, our facility in Mukachevo, Ukraine, was damaged during a missile strike. Our emergency protocols were executed to ensure the full evacuation of the site.
TPCA Establishes Thailand PCB Academy in Bangkok
08/22/2025 | TPCAA distinguished delegation of distinguished guests from industry, government, academia, and research in Taiwan and Thailand, including representatives from the Ministry of Higher Education, Science, Research, and Innovation (MHESI), the Board of Investment of Thailand (BOI), and the Taipei Economic and Cultural Office in Thailand (TECO), as well as professors from several Thai universities and member companies, attended the historic occasion.
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.