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January 6, 2016 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be exhibiting and educating at the upcoming DesignCon. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center (Santa Clara, California).
On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will participate in a 75-minute panel discussion targeting effective measurement methods for high-frequency/high-speed printed-circuit-board (PCB) materials.
This technical presentation will focus, in particular, on frequencies above 10 GHz, as needed for a growing number of applications, including many emerging wireless communications systems. Conducted by the IPC D-24c task group (www.ipc.org) on High Frequency Test Methods, the round-robin-style panel discussion (“Track 05: Characterize PCB Materials and Processing”) will explore the properties of some of the latest circuit materials and examine different methods for testing and characterizing those materials. Joining John Coonrod in the discussion will be Glenn Oliver, Senior Engineer at DuPont, and Don DeGroot, President of CCN.
Also, Dr. Allen F. Horn III will be presenting “Effect of conductor profile structure on propagation in transmission lines” at 9:20 AM on Thursday, January 21 and participating as a member of the August panel discussion “Getting smooth copper and keeping it” at 3:45 PM on Thursday, January 21.
As part of the DesignCon Expo Hall, representatives from Rogers Corp. (www.rogerscorp.com) will be exhibiting at Booth #702, with information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, and RO3003™ laminates. Rogers will also be previewing their new material system developed for ultra low loss digital applications.
ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers high yields in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, it is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
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