Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Yamaha Motor, SRI International Collaborate on the Development of MOTOBOT at CES 2016
January 7, 2016 | PRNewswireEstimated reading time: 3 minutes
Going forward, technology for machine position recognition (including high-precision GPS and sensor fusion) and machine learning will be utilized to enable MOTOBOT to make its own decisions regarding the ideal line to take around a racetrack while pushing and adapting to the limits of a given motorcycle's performance. This way MOTOBOT can improve its lap times with each successive lap of the track. Initial trials have begun in closed test areas - these will continue as development progresses.
"We are thrilled to collaborate with Yamaha Motor on MOTOBOT in order to have a significant and positive impact on high-performance vehicle development," added Thomas P. Low. "At CES, we will demonstrate how far humanoid robots have advanced in efficiency and performance, and how industry leaders such as Yamaha Motor can leverage robotics to solve business challenges, create competitive advantages and accelerate innovation."
About SRI International
SRI International creates world-changing solutions making people safer, healthier, and more productive. SRI, a research center headquartered in Menlo Park, California, works primarily in advanced technology and systems, biosciences, computing, and education. SRI brings its innovations to the marketplace through technology licensing, spin-off ventures and new product solutions.
About Yamaha Motor
Yamaha Motor is a global producer of motorcycles, marine products, power products and surface mounters. The company's diverse business and wide variety of products are built around its proprietary technologies focused on small engines, fiberglass-reinforced plastics and electronic control. Yamaha Motor conducts global development, production and marketing operations through 140 subsidiaries and equity-method affiliates in 30 countries. About 90% of consolidated net sales are generated in more than 200 countries outside of Japan. The company is steadily restructuring its global engineering, manufacturing and marketing capabilities for sustainable long-term growth.
Page 2 of 2Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory
08/08/2025 | PRNewswireMacronix International Co., Ltd., a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a single device, the essential performance and an array of security features that deliver rapid boot times and iron-clad data protection.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.