Yamaha Motor, SRI International Collaborate on the Development of MOTOBOT at CES 2016
January 7, 2016 | PRNewswireEstimated reading time: 3 minutes
Going forward, technology for machine position recognition (including high-precision GPS and sensor fusion) and machine learning will be utilized to enable MOTOBOT to make its own decisions regarding the ideal line to take around a racetrack while pushing and adapting to the limits of a given motorcycle's performance. This way MOTOBOT can improve its lap times with each successive lap of the track. Initial trials have begun in closed test areas - these will continue as development progresses.
"We are thrilled to collaborate with Yamaha Motor on MOTOBOT in order to have a significant and positive impact on high-performance vehicle development," added Thomas P. Low. "At CES, we will demonstrate how far humanoid robots have advanced in efficiency and performance, and how industry leaders such as Yamaha Motor can leverage robotics to solve business challenges, create competitive advantages and accelerate innovation."
About SRI International
SRI International creates world-changing solutions making people safer, healthier, and more productive. SRI, a research center headquartered in Menlo Park, California, works primarily in advanced technology and systems, biosciences, computing, and education. SRI brings its innovations to the marketplace through technology licensing, spin-off ventures and new product solutions.
About Yamaha Motor
Yamaha Motor is a global producer of motorcycles, marine products, power products and surface mounters. The company's diverse business and wide variety of products are built around its proprietary technologies focused on small engines, fiberglass-reinforced plastics and electronic control. Yamaha Motor conducts global development, production and marketing operations through 140 subsidiaries and equity-method affiliates in 30 countries. About 90% of consolidated net sales are generated in more than 200 countries outside of Japan. The company is steadily restructuring its global engineering, manufacturing and marketing capabilities for sustainable long-term growth.
Page 2 of 2Suggested Items
PCB Market Size to Grow by $29.06B from 2024-2028
05/17/2024 | PRNewswireThe global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.
SiPearl: Partnership with Samsung Electronics for built-in HBM in Rhea
05/14/2024 | BUSINESS WIRESiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung Electronics Co. Ltd., a world leader in advanced memory technology, to equip its Rhea series with Samsung’s advanced memory solution ideal for HPC and AI applications.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
05/09/2024 | ANSYSAnsys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.