Yamaha Motor, SRI International Collaborate on the Development of MOTOBOT at CES 2016
January 7, 2016 | PRNewswireEstimated reading time: 3 minutes
Going forward, technology for machine position recognition (including high-precision GPS and sensor fusion) and machine learning will be utilized to enable MOTOBOT to make its own decisions regarding the ideal line to take around a racetrack while pushing and adapting to the limits of a given motorcycle's performance. This way MOTOBOT can improve its lap times with each successive lap of the track. Initial trials have begun in closed test areas - these will continue as development progresses.
"We are thrilled to collaborate with Yamaha Motor on MOTOBOT in order to have a significant and positive impact on high-performance vehicle development," added Thomas P. Low. "At CES, we will demonstrate how far humanoid robots have advanced in efficiency and performance, and how industry leaders such as Yamaha Motor can leverage robotics to solve business challenges, create competitive advantages and accelerate innovation."
About SRI International
SRI International creates world-changing solutions making people safer, healthier, and more productive. SRI, a research center headquartered in Menlo Park, California, works primarily in advanced technology and systems, biosciences, computing, and education. SRI brings its innovations to the marketplace through technology licensing, spin-off ventures and new product solutions.
About Yamaha Motor
Yamaha Motor is a global producer of motorcycles, marine products, power products and surface mounters. The company's diverse business and wide variety of products are built around its proprietary technologies focused on small engines, fiberglass-reinforced plastics and electronic control. Yamaha Motor conducts global development, production and marketing operations through 140 subsidiaries and equity-method affiliates in 30 countries. About 90% of consolidated net sales are generated in more than 200 countries outside of Japan. The company is steadily restructuring its global engineering, manufacturing and marketing capabilities for sustainable long-term growth.
Page 2 of 2Suggested Items
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd