Yamaha Motor, SRI International Collaborate on the Development of MOTOBOT at CES 2016
January 7, 2016 | PRNewswireEstimated reading time: 3 minutes
Going forward, technology for machine position recognition (including high-precision GPS and sensor fusion) and machine learning will be utilized to enable MOTOBOT to make its own decisions regarding the ideal line to take around a racetrack while pushing and adapting to the limits of a given motorcycle's performance. This way MOTOBOT can improve its lap times with each successive lap of the track. Initial trials have begun in closed test areas - these will continue as development progresses.
"We are thrilled to collaborate with Yamaha Motor on MOTOBOT in order to have a significant and positive impact on high-performance vehicle development," added Thomas P. Low. "At CES, we will demonstrate how far humanoid robots have advanced in efficiency and performance, and how industry leaders such as Yamaha Motor can leverage robotics to solve business challenges, create competitive advantages and accelerate innovation."
About SRI International
SRI International creates world-changing solutions making people safer, healthier, and more productive. SRI, a research center headquartered in Menlo Park, California, works primarily in advanced technology and systems, biosciences, computing, and education. SRI brings its innovations to the marketplace through technology licensing, spin-off ventures and new product solutions.
About Yamaha Motor
Yamaha Motor is a global producer of motorcycles, marine products, power products and surface mounters. The company's diverse business and wide variety of products are built around its proprietary technologies focused on small engines, fiberglass-reinforced plastics and electronic control. Yamaha Motor conducts global development, production and marketing operations through 140 subsidiaries and equity-method affiliates in 30 countries. About 90% of consolidated net sales are generated in more than 200 countries outside of Japan. The company is steadily restructuring its global engineering, manufacturing and marketing capabilities for sustainable long-term growth.
Page 2 of 2Suggested Items
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions
04/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025
04/29/2025 | congateccongatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.